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CLICK HERE for
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COMMUTATOR MICA UNDERCUTTING SAWS: |
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COMMUTATOR UNDERCUTTING
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U-Slot |
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When using a circular cutter, the width of the cutter is chosen to exceed slightly the thickness of the mica. It is recommended the the SAW THICKNESS be figured on the basis of the mica thickness plus 0.003" (0.08mm). This will allow the saw to remove the full width of the mica pus 0.0015" (0.04mm) of copper on each side of the mica slot. If unable to determine the mica width, the use of a feeler gauge can best determine the required saw thickness. Consequently, some copper is cut or dragged off the bar during undercutting, (as shown in Fig. 2). |
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In addition to leaving a jagged edge
projecting from the commutator bar, the edge of the bar becomes somewhat
work-hardened and hence will not wear down uniformly. Therefore the
edges of the bars must be chamfered by using a suitable slotting file or a
specialty shaped scrapper. **See Martindale Slotting Scrappers |
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V-SLOT V-slots keep
slots free from dust accumulations at low speeds, and do not require a
separate operation for chamfering of the bar edges. V-slots are
usually made with either a slotting file, or a "V" tooth circular cutter. |
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To obtain a 1/16 inch deep cut with a
1/32 inch free copper above the mica, the following table may be used: |
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COMPOUND LAND The teeth on the compound land mica saw are alternately ground to a special taper which reduces the impact on each individual tooth and produces ships of just slightly over half the width of the mica slot thereby eliminating the tendency to clog. When undercutting with a compound land saw the bottom of the slot will appear to be flat. However, as a result of the reverse taper on alternate teeth, the slot will have a slight pyramid or convex surface. this type of a saw operates cooler and cleans better thereby prolonging the saw life with resulting economy to the user. |
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After a commutator has been undercut, it should be very carefully inspected to assure that all copper particles have been removed, that the bars have been carefully chamfered, and that all sharp edges and burs have been eliminated. Then each slot should be individually checked and reworked as necessary to remove any traces of fin or side mica. Finally, the surface should be lightly polished with a fine-grain commutator stone. **A more popular method is the use of rubber bond cleaning stone, which will properly finish the surface and leave the proper filming required. |
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